Freescale SemiconductorApplication NoteDocument Number:AN4156Rev. 0, Draft C, 16 August 2011MPC563xM Engine Control UnitReference Design4-Cylinder Hardware Designby:Randy Dees, Lei Gao, Mike Garrard, Karl-Ferdinand Leiss, and Hua QianMSG Automotive ApplicationsAustin, TexasUSAContents1 Introduction1Introduction.1The MPC563xM1 family of microcontrollers are intended forlow-end automotive Powertrain applications, primarily 4cylinder engines. They can also be used for other applicationsas well. This application note describes a basic 4-cylinderEngine Control Unit (ECU) Reference Design. The referencedesign includes a case and all of the electronics required to runa Stage IV or V port fuel injected gasoline engine.2System Features Overview.23MPC563xM overview.44Freescale SmartMOS Analog Devices .255Other Circuitry.496S08SG8 8-bit Safety MCU.507Module internal jumpers andconnectors.528Mechanical Housing, ExternalConnectors, and PCB Specifications.539Debug Features of the ECU.60ASchematic Appendix .63BMPC563xM Bill of Materials.63CMPC563xM ECU Connector.69DVRS Circuit.73EAdditional MPC563xM HardwareTopics.74The MPC563xM devices are based on the e200z335 32-bitPower Architecture core and includes up to 1.5M Bytes ofinternal flash and up to 94K of internal SRAM. The ECUimplements all of the external drivers to implement a 4cylinder gasoline engine using Freescale SmartMOS devices.The MPC563xM Reference Design uses the followingdevices: MPC563xM - 32-bit RISC Power Microcontroller optimized for Powertrain Automotive applications(referred to in this application note as the main MCU) MC33810 - Ignition Injector Device (IID)1.The MPC563xM Family consists of the MPC5634M, theMPC5633M, and the MPC5632M that offer differing sizeson internal SRAM, Flash, and other features. 2010–2011 Freescale Semiconductor, Inc.PreliminaryGeneral Business Information

System Features Overview— 4 low side drivers for injectors— 4 IGBT predrivers for ignition— Dwell time monitor, overlapping dwell compensation, spark duration, coil sense— SPI interface to MCU for diagnostic information MC33905 - System Basis Chip SBC— Two 5 volt power supplies— LIN interface— CAN interface— Watchdog MC33902 - High Speed CAN Interface with diagnostic port SPI interface to MCU for diagnostic information MC33661 - LIN Transceiver MC33800 - Multi-Function Engine Control/Driver— Octal Serial Switch, Hex Gate Driver and HEGO driver and 2 Constant Current drivers— 6 x 1A LS Outputs - internal PowerFETs— 2 x 4A LS Outputs - internal PowerFETs— 2 x CCD - Constant Current LS drivers with dithering— 6 x Gate Pre-Drivers (HEGO) - measures resistance via internal analog MUX MC33926 - Single 5A H-Bridge - 225 mOhm, PQFN or SOIC package MC33932 - Dual 5A H-Bridge Driver, HSOP package MC33879 High Side/Low Side Drivers— 8 floating MOSFETs MPXH9002 - Barometric Pressure Sensor MC9S08SG8 - Low Cost, High Performance 8-bit Microcontroller (Secondary/Safety MCU) 20-pin package SPIInternal Clock2 System Features OverviewThe MPC563xM Engine Reference Design is a fully functional Engine Control Unit (ECU) hardware design that is capableof running a four-cylinder gasoline engine while meeting stringent requirements for emissions. The design is packaged in arobust enclosure that allows evaluation on an engine in a dynamometer and in vehicles.This ECU implements a range of sensors and actuators typical of a drive-by-wire port fuel injection engine control systemmeeting the EU Stage-V emissions level. It is intended to be representative rather than an exact feature set. One example ofpossible sensors and actuators is shown in the block diagram Figure [CROSS REFERENCE FIGURE 1].Some of the sensors would be expected on all such systems, such as the engine and air temperature sensors. Some would not,such as the fuel level input. Some of the actuators would be expected on all such systems, such as the four fuel injectors.Some would not, such as the fuel efficiency gauge. There are three sources of variation possible on this ECU design:1. Whilst some inputs are dedicated to particular functions, for example the knock sensor pins on the MCU, others aregeneral, such as most other ADC inputs, and thus might be used for different functions.2. Whilst some outputs are dedicated to particular functions, for example the ignition coil pins from the IGBTs andMC33810, others are general, such as the MC33800 low side drivers, and thus might be used for different functions.3. In a small number of cases alternative devices might be connected to the output pins: specifically, jumpers can be usedto configure whether the MC33932 or the MC33879 is connected to the external actuator. This allows the option ofdriving either low, high or totem pole 1A loads, or a 5A H-bridge.Features of the module include: 32-bit Power Architecture core Microcontroller with 1.5 MBytes of flash and 94 KBytes of SRAM.8-bit Microcontroller connected to be able to perform intelligent safety checkingTwo CAN interfaces, ISO 11898-2 and 11898-5 compliant, one wired for diagnostic capabilitiesOne LIN (LIN 2.0 and 1.3 compliant, and SAE J2602 compatible) or K-Line interfaceMPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 20112PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

System Features Overview Four ignition coil driversFour 'high impedance' injector driversAir Pressure sensorOne 5A H-bridge DC motor throttle control2A dual 5A H-bridge stepper motor control for D.C. motors such as variable cam actuation or EGRTwo MOSFET pre-divers for oxygen sensor heater controlOne 1A constant current driver with dithering for solenoid controlSeven low-side drivers for control of fuel pump, relays, coolant temperature gauge, tacho etc.Eight 1A high/low side drivers for stepper motor control2Internal debug connectors for both JTAG and nexus (requires uncased board)Analog inputs for resistive sensors such as thermistors, and voltage sensors such as MAPDigital inputs for rotary sensors such as crank, cam and vehicle speedIgnitionSwitchSensor supplyK-LineBrakeSwitchCANPower steeringPressure switchIgnition /Coms: CAN LINPower supply MC33905 InjectionHS CANGPIO/ADCClutch SwitchAcceleratorPedalPositionFront & RearOxygen fetyS f tMC9S08SGManifoldpressureInlet Air TempCrankshaftPositionD.C. MotorThrottleMC33926Dual 5AH-BridgeH relayMC33879Low sidedriversFanRelayHighCanisterpurgesolenoidFront& Rear OxygenSensor mshaftpositionFanRelayLowMainRelayHi/Lo drvrMCUEngineTempTPUVehicleSpeed5A H-BridgeMC33932MPXH9002AC TempIgnition e 1. MPC563xM example engine reference design block diagram2.1 Enclosure overviewThe enclosure used in the design is a commercially available robust unit manufactured by Cinch in the USA and purchasablethrough distributors such as Newark. The intent is to enable the hardware to be evaluated in harsh environments such as anengine bay or dynamometer. The case is not rated for full automotive temperature range, nor has the board been evaluated forthis. Although a heat-sink bracket is used, the enclosure is designed for heat-sinking of leaded TO220 package devices and sothe thermal paths from the SMD SMOS (surface mount transistors) is not ideal. The enclosure is waterproof. It is also cliptogether. If it is desirable to open it up without the dedicated and somewhat costly tool available from Cinch, removal of the10 barbs on the long edges is recommended. This permits the case to be opened using a screwdriver to gently lever the twolarge barbs on the short edges. With the case seal removed this process can be repeated many times. Removing the small2.Two options are implemented for air control: full Electronic Throttle Control using an H-bridge driven DC motorcontrol or four 1A totem outputs for a bypass air stepper motor.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 2011Freescale Semiconductor, Inc.PreliminaryGeneral Business Information3

MPC563xM overviewbarbs will at the same time adversely affect the sealing of the enclosure. The two loom side connectors are keyed and cannotbe installed incorrectly. Terminals for the loom side connector are available in two sizes to fit different wire gauges. Thesmaller size was used for the powertrain demonstration built around this ECU. Hole blanks are available for sealing the loomside header in positions where wires are not fitted.2.2 Software overviewThe demonstration software available does not, nor is it intended to meet Stage V emissions. It is intended to be nonproduction code that might be examined to provide an example idea as to how these devices can be controlled. Freescale hasno control over the exact engine or system configuration to which the ECU might be attached, nor do we run validationprograms on engines or cars. However, parts of the code might successfully be used within an application to achieve thedesired functions. It is the responsibility of all users to validate their own code.Due to the complexity of the task, a description of the code architecture and functionality will be released in a separateapplication note.2.3 Layout overviewThe PCB layout is available in Gerber and Altium formats. The Gerber files are an industry standard for multiple layerboards that requires the user to re-construct the PCB from multiple files. The order of the layers is important and must beadhered to. Free Gerber viewers are available such as Gerbtool [link]. The Altium format contains all layers pre-assembled. Itis more powerful and also more complex to drive, but provides better features such as Net identification and search. A freeviewer is available as a large download [link].With the connector on the left, the PCB is divided approximately into four sections as shown in Figure x.x[artwork p10]. Atthe top by the heat-sink are the high voltage and high current drivers. The ignition coils are particularly noisy, and emitbroadband noise up to the 10's MHz region as the energy stored in the coils is transferred to the spark plugs. Switching ofmultiple amps is required and produces hundreds of volts. These drivers are closely couple with the front connector via highcurrent tracks, and kept clear of sensitive inputs. The high current motor driver tracks are likewise kept toward the top regionof the board, with the somewhat lower current injectors and PWM outputs from the MC33800 and MC33879 further down.In the bottom right corner is the digital section. This includes the MPC5634M microcontroller, with closely coupled tracksfor the crystal oscillator and carefully applied capacitor decoupling. The high speed digital NEXUS interface is in this corneras well as the lower speed JTAG interface. Also associated with the digital side is the MC9S08 safety micro, and digital CANinterfaces.The bottom left corner contains the analog inputs. Some, such as the crank sensor interface, must be particularly sensitive asthe input signal might be only 150mVp-p. Analog inputs such as throttle and MAP are critical to engine control and shouldbe kept as quiet as possible.In-between the analog and high current drivers is the power supply. This forms some degree of barrier to some of the noise.General advice on laying out PCBs can be found on the Freescale website, such as presentation FTF11 ENT F0964 fromworkshops held at the Freescale Technology Forum events.3 MPC563xM overviewThe MPC563xM family of devices are highly integrated, 32-bit Power Architecture microcontrollers that are intendedprimarily for low-end 4-cylinder gasoline engines; however they can be used for many other types of applications. Thedevice contains many features designed for powertrain control. The MPC563xM Reference ECU makes use of these andshows the hardware connected in a representative way. Two of the features that are highlighted in this design are theenhanced Timing Processing Unit (eTPU) and the knock processing sub-system incorporated into the device.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 20114PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

MPC563xM overviewNote that this MCU is avalable on a stand-alone evaluation board with built in de-bugger at a very competitive price: partnumber DSP &floating point)DMAVLENexusMMUIEEE-ISTO5001-2003Caal Bus Interfacce3x4CCrossbarb SSwitchit hI/OBridgeSIU1.5MFLASH94KSRAMADCi DECDCADDCADDS PIDS PIeSCCIeSCCICANFlexC3k DataeTPU2RAM3214k CodeC GAAMuxFigure 2. MPC5634M block diagramFeatures of the MPC563xM microcontrollers are: Powerful Power Architecture CPU core that supports traditional PowerPC instruction set or the Variable LengthEncoded (VLE) instruction set for reduced code footprint Integrated knock detection hardware and DSP engine Hardware floating point support for model based code Compatible CPU/device/pinout roadmap for application migration (more IO and more memory or less memory and IO) Hardware or software calibration solutionsThe devices are available in several different memory configurations and feature options.Table 1. MPC563xM family memory optionsFeatureMPC5632MMPC5633MMPC5634MFlash Memory Size768 KBytes1 MBytes1.5 MBytesSRAM Memory Size48 KBytes64 KBytes94 KBytesMPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 2011Freescale Semiconductor, Inc.PreliminaryGeneral Business Information5

MPC563xM overviewThe table below shows the different package and speed options for the device. The MPC563xM ECU Reference Design usesthe largest memory configuration device (MPC5634M) and the 144 PQFP package.Table 2. MPC563xM package and speed optionsPackageMPC5632MMPC5633MMPC5634M144 PQFP40, 60 MHz40, 60, 80 MHz60, 80 MHz176 PQFP—60, 80 MHz60, 80 MHz208 MAPBGA—60, 80 MHz60, 80 MHzThe MPC563xM devices include a multitude of on-chip peripherals for timing control and communications. The table belowshows the peripheral modules available in the devices.Table 3. On-chip peripheralsFeatureProtocolNumber availableMPC5632MTimersenhanced Modular Input/Output System 8 channels(measurement and (eMIOS)generation)enhanced Timing Processing Unit16 channels(eTPU)Timers al Interrupt Timers (PIT)4 channelsReal Time Interrupt (RTI)1 channelSystem TimerModule (STM)4 channelsenhanced SerialCommunicationsInterface (eSCI)RS-232DMPC5634M16 channels2 interfacesLIN1K-LineDeserial/Serial Peripheral Interface(DSPI)2 interfaces2Flexible ControllerArea Network(FlexCAN)2 interfacesCANenhanced Queued Analog to Digitalconverter (eQADC)32 channelsDifferential Channels34 differential channelsVariable Gain Amplifiers (x2,x4)4Decimation Filters1.2.3.4.MPC5633M34 channels41Local Interconnect NetworkMicrosecond bus compatibleDifferential channels use two of the single-ended channels.Only usable on the differential channels.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 20116PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

MPC563xM overview3.1 Internal SRAMDepending on the device in the family, the SRAM available is different on each of the members of the MPC563xM familydevices.Table 4. SRAM Standby SRAMSize24 KBytes24 KBytes32 KBytesStart AddressEnd AddressTotal SRAM Size48 KBytes64 KBytes94 KBytes0x4000 00000x4000 5FFF24 KBytesStandby SRAMStandby SRAMStandby SRAM0x4000 60000x4000 7FFF8 KBytesSRAMSRAMStandby SRAM0x4000 80000x4000 BFFF16 KBytesSRAMSRAMSRAM0x4000 C0000x4000 FFFF16 KBytesNot AvailableSRAMSRAM0x4001 00000x4001 77FF30 KBytesNot AvailableNot AvailableSRAMPart of the SRAM is powered by a separate SRAM Standby Supply voltage (VSTBY). VSTBY can either be a 1.0V supply(0.95 to 1.2V) or a supply between 2.0 and 5.5 volts. If stand-by operation is not required, VSTBY can be connected toground.AttentionVSTBY must never be left floating.On the MPC563xM ECU Reference Design, VSTBY is grounded.3.2 Flash MemoryThe MPC563xM Devices contain internal nonvolatile flash memory for holding code for execution. The following tableshows the blocks of the flash that are available on the different members of the family.Table 5. Flash array mapStart tes)(1 MByte)(1.5 MBytes)0216 KBytesAvailableAvailableAvailable0x0000 4000Low AddressSpace1a216 KBytesAvailableAvailableAvailable0x0000 8000256 KBytes1b332 KBytesAvailableAvailableAvailable0x0001 00002a232 KBytesAvailableAvailableAvailable0x0001 80002b316 KBytesAvailableAvailableAvailable0x0001 C0003216 KBytesAvailableAvailableAvailable0x0002 00004264 KBytesAvailableAvailableAvailable0x0003 00005264 KBytesAvailableAvailableAvailable0x0000 00000x0004 0000Mid-AddressSpace6128KBytesNot availableAvailableAvailable0x0006 0000256 KBytes7128KBytesNot availableAvailableAvailableBank1Bank 0, Array 0Table continues on the next page.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 2011Freescale Semiconductor, Inc.PreliminaryGeneral Business Information7

MPC563xM overviewTable 5. Flash array map (continued)Start tes)(1 MByte)(1.5 MBytes)0x0008 0000High x000A 00001.0 MBytes9128KBytesAvailableAvailableAvailable0x000C 000010128KBytesAvailableAvailableAvailable0x000E 000011128KBytesAvailableAvailableAvailable0x0010 000012128KBytesNot availableNot availableAvailable0x0012 000013128KBytesNot availableNot availableAvailable0x0014 000014128KBytesNot availableNot availableAvailable0x0016 000015128KBytesNot availableNot availableAvailableS016 KBytesAvailableAvailableAvailable0x00FF C000Shadow BlockBank1Bank 1, Array 1Bank 1, Array 2Bank 0, Array 016 KBytes1. Read while write (RWW) can only be performed between Bank 0 and either of the arrays in Bank 1. RWW cannot be donebetween Array 1 and Array 2 of Bank 1.2. Can boot from this block.3. Cannot boot from this block.Two of the blocks on the MPC563xM Low Address Space are not bootable. See the device reference manual for details onthe boot process and the valid boot configuration identifier.3.3 Reset ConfigurationInformation to be added.3.4 External ADC connectionsDescription to be added.3.4.1 Power Management Controller (PMC) Monitor ChannelsMPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 20118PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

MPC563xM overviewMany of the PMC reference and output voltages can be monitored by the on chip Analog to Digital Converter (eQADC).These on-chip voltages can therefore be monitored by the application software. As well as monitoring power supplies on allpin banks, and ADC references, there is an internal temperature sensor and bandgap reference for application use. Some ofthese signals can only be converted by one of the on-chip ADCs. The available PMC signal channels are shown in thefollowing table.Table 6. Power Supply ADC Monitor ChannelsADC ChannelADCMPC563xM 50% x (VRH - VRL)43ADC0/ADC175% x (VRH - VRL)44ADC0/ADC125% x (VRH - VRL)45ADC0, ADC1Band Gap128ADC0, ADC1Temperature Sensor144ADC0Buffered Band Gap voltage145ADC0Reference voltage for the 1.2V Low Voltage Detect146ADC0Reference voltage for the 1.2V regulator controller147ADC0Reference for the 3.3V Low Voltage Detect1162ADC050% of VDDEH1B163ADC050% of VDDEH1B164ADC050% of VDDEH4B165ADC050% of VDDEH6A166ADC050% of VDDEH6B167ADC050% of VDDEH7180ADC0Reference voltage for 5.0V Low Voltage Detect 1181ADC0Reference for the LVI3p3 h6 sampling reference182ADC0Reference for the 3.3V Supply Regulator183Not Used196ADC1VRC33 - 3.3V supply of the device197ADC1VRC33 - 3.3V supply of the device198ADC1VDD12 - 1.2V supply of the device199ADC150% of VDDEH1A1. The voltage on this channel should be compared to the buffered Band Gap voltage to determine the actual low voltage trippoint.3.5 Internal Power SuppliesThe VDD Regulator Input (VDDREG) is the 5 volt input to the internal 3.3 volt regulator and 1.2 volt regulator controller. Ifthe internal regulators are not being used, VDDREG can be tied to VSS to disable their operation. However, this disablesinternal low voltage detect circuits. To keep the internal low-voltage detect circuits powered, VDDREG can be connected to5 volts, even when the internal regulator circuits are not used.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 2011Freescale Semiconductor, Inc.PreliminaryGeneral Business Information9

MPC563xM overview3.5.1 3.3 Volt Power SupplyThe 3.3 volt internal regulator is completely contained within the device and only requires the input supply (VDDREG) and abypass capacitor on the 3.3 volt output (VRC33). The 3.3 volt supply is used for internal operation of the device, includingpowering parts of the flash module within the device.The 3.3 volt regulator is intended to power internal circuitry only and was not designed to power external pins of the device.However, there are times that this supply could be used power a small number of pins. {Note - this needs to be evaluatedfurther.}NOTEIn the 144 QFP package, the JTAG/Nexus pins output a 3.3 volt level, however, thesesignals are not powered by the 3.3 internal regulator. These pins are powered by the 5volt power supply and the output voltage is limited in the output drivers of the signals.On the MPC563xM ECU VRC33 is used for the reference on the debug connector for theJTAG/Nexus interface.3.5.2 1.2 Volt Power Supply Input and Regulator ControllerThe majority of the internal device circuitry is powered by the 1.2 volt VDD input. This includes all of the CPU core and themajority of the internal logic of the device. An internal regulator controller is implemented to provide a low cost powersupply option. By utilizing an external transistor, the power loss from reducing the 5 volt supply to 1.2 volts does not have tobe dissipated within the MCU package and can be handled externally.The 1.2V regulator controller provides a current signal (VRCCTL) that feeds the base of an external NPN transistor. Thiscontrols the current flow from the 5 volt supply (approximately 3-7V range permissible) connected to the transistor collectorand the transistor emitter provides the 1.2 volt supply. Inside the package, a sense signal is connected to the VDD internalsupply input. This signal is compared to an internal Band Gap reference that sets the regulator reference voltage. Dependingon the voltage on VDD, the current on the VRCCTL signal is raised or lowered to maintain the 1.2 volt level. Management Controller 1.2V External CircuitryThe figure below shows the required external circuitry for the internal regulators of the device. Some of this circuitry may notbe required, but space should be saved for all of these components for the target system. Evaluation of the final board layoutand the external power supply may allow some of these components to be removed.Regulator stability is controlled by many factors, including the phase response of the regulator loop. The transistor responseand parasitic components due to PCB layout impact the phase response yet are external to the MCU. It can also be affectedby noise coupling from the supply feeding the regulator (5 volt supply). The loop also depends on the gain of the transistor,the impedance of the 5V power supply, and the transient response time of that supply. Slower transient response times willrequire additional bulk capacitance at the MCU to compensate for the response time of the power supply.A bypass capacitor should be added right at the collector of the external NPN pass transistor, which should be connected toVDDREG.A snubber circuit should be connected on the VRCCTL signal from MCU to the base of the external pass transistor. Thisresistor-capacitor arrangement adjusts the phase of the loop to compensate for excessive parasitic inductance and eliminateany oscillation. The snubber circuit also reduces any noise coupling from the source supply for the pass transistor. Thisprovide the most robust solution for any typical situationMPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 201110PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

MPC563xM overviewKeep inductance from 5V supplyto the transistor collector andVDDREG below 1 μH5V frompower supply10 μF** Only required ifRS is used.3.3V OutRS470 pFVRCCTL15 ΩThe RC on VRCCTLis dependent on thestability of the supplyfeeding the collectorof the BCP68.VRC332 μFBCP6810 μFVDDREGREKeep inductancebelow 100 nHVDDSense is internalto the package andis not brought outseparately on thepackage.680 nFVDDSenseVDDVRCVSSVSS4 6.8 μFLocate 1 at each corner of the device4 220 nFFigure 3. PMC External CircuitryThe following table shows the recommended components for the 1.2V regulator circuit. The worst case typical systemcomponents should be used until a complete evaluation of the target system power supply has been performed. RE is notrequired for the MPC563xM devices. It can either be shorted or a 0 Ω resistor can be used.Table 7. Recommended external components for the 1.2V regulator controllerComponentsMPC563xM Worst Case TypicalSystem4 x 6.8 uF1,2VDD Bypassing4x220 nF ceramicSnubberResistor15 ΩCapacitor680 pF310 uF2Source bypass capacitor (pass transistor collector)VDDREG bypass capacitor310 uFSource resistor (RS in the above figure)3.3 ΩEmitter resistor (RE in the above figure)0Ω1. Maximum ESR of 200mΩ each2. The VDD and source bypass capacitors should be the same type of capacitor to keep the series impedance matched.3. The source bypass capacitor and the VDDREG Bypass capacitor can be the same if there is no Resistance betweenVDDREG and the collector of the pass transistor.A series resistor (RS) can be used on the pass transistor collector to reduce the power dissipation required by the passtransistor. Depending on the transistor selected, the power dissipation to required to drop the VDDREG voltage (nominal 5volts) down to the VDD voltage (1.2V) may be more than the transistor package allows for the temperature encountered andheatsinking provided. If RS is used, both the transistor collector and VDDREG should be bypassed. If RS is not used, a singlebypass capacitor can be used for both. In this case, the capacitor should be close to the transistor collector, but should still beplaced close to VDDREG.An alternate method to reduce the power dissipation requirements of the pass transistor is to use a nominal 3.3V source (if asuitable external 3.3V supply is available in the target system) for the transistor collector. In this case, VDDREG should stillbe connected to the nominal 5 volt supply. Both supplies should be well bypassed.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 2011Freescale Semiconductor, Inc.PreliminaryGeneral Business Information11

MPC563xM overview3.6 Recommended Power Supply Bypass CapacitorsThe table below shows the recommended number and values of bypass capacitors for each of the digital power supply pins.Table 8. Recommended Digital Power Supply Bypass CapacitorsSupplyQuantityValueuF1VDDREG110VDD46.8 uF24220 nFVRC3312.2uFVDDEH410 nFVDDPLL1100 nF110 nF110 nFVSTBYNotesThe capacitor should belocated very near the collectorof the pass transistor and tiedto the ground plane as near tothe MCU as possible.Locate at the 4 corners of thedevice.1. Depending on the impedance of the power supply, a value of up to 100 uF may be required. This depends on the transientresponse time and impedance of the supply.2. See the PMC External Circuitry section of this application note.The table below shows the recommended bypass capacitors for the Analog power supplies of the device.Table 9. Recommended Digital Power Supply Bypass CapacitorsSupplyQuantityValueVDDA110 uFVRH110 nFVRL0-VSSA0-NotesConnect directly from VDDAto VSSA.Connector to ground plane ofthe board.MPC563xM Engine Control Unit Reference Design, Rev. 0, Draft C, 16 August 201112PreliminaryGeneral Business InformationFreescale Semiconductor, Inc.

MPC563xM overview3.7 MCU PeripheralsThe MPC563xM includes many on-chip peripherals. These peripherals are mapped to the pins of the device and in somecases, multiple functions are available on the same pin of the device. The use of the peripheral pins is shown in this sectionfor the on-chip peripherals.Table 10. On-chip peripheral summaryPeripheral ModuleSymbolFunctionalityNumber of ModulesNumber of channels(total)Deserial/SerialPeripheral InterfaceDSPISynchronous serialcommunication (SPI)22Enhanced QueuedAnalog to DigitalConvertereQADCAnalog to Digitalinterface1Up to 34Enhanced ModularInput/Output SystemeMIOSTiming channels1Up to 16Enhanced SerialCommunicationsInterfaceeSCIAsynchronous Serialinterface22Enhanced TimingProcessing UniteTPUProgrammable timingprocessor132CAN serialcommunications22Flexible Controller Area FlexCANNetworkIn addition to the on-chip peripherals with pin interfaces, some peripherals are available internally

adhered to. Free Gerber viewers are available such as Gerbtool [link]. The Altium format contains all layers pre-assembled. It is more powerful and also more complex to drive, but provides better features such as Net identification and search. A free